Composto per resinatura in Poliammide Power Adhesives, col. Nero, Adesivo

The Power Adhesives polyamide potting and encapsulating compound is a hotmelt adhesive with a very low viscosity that runs well through most 12mm glue guns. It can replace traditional potting compounds, such as epoxy or polyurethane, which require mixing and contain hazardous chemicals. As it is stored and sealed in its foil pouch, its shelf life can be 12 months or more.

Very fast setting time (<2min)
No mixing, no waste
No flushing or cleaning of equipment between use
Will work in most high performance 12mm glue guns
Heat resistance of 135°C and a softening point of 160°C
Solid black colour thereby hiding all components
Cost effective
shelf life is 12 months

UL 94 approved
ANSI/ESD S20.20:2014
BS EN 61340-5-1:2007
CE certified
ISO 9002